Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers
Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers
Christopher Jahnes, Eric Huenger, Scott Kisting,
Jahnes, Christopher, Eric Huenger, and Scott Kisting. 2011. “Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers.” IMAPSource Proceedings 2011 (DPC): 666–98. https://doi.org/10.4071/2011DPC-ta32.