Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers
Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers
Jahnes, Christopher, Eric Huenger, and Scott Kisting. 2011. “Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers.” IMAPSource Proceedings 2011 (DPC): 666–98. https://doi.org/10.4071/2011DPC-ta32.
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