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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers

Christopher Jahnes, Eric Huenger, Scott Kisting,
Through Silicon Via (TSV)Redistribution layer (RDL)Large Dieepoxybenzocyclobutene (BCB)TSVsilicon carrierchip stacking(3D) redistribution layer (RDL)spin on dielectric (SOD)flip chiplarge diethermal cyclewafer thinning
https://doi.org/10.4071/2011DPC-ta32
IMAPSource Conference Papers
Jahnes, Christopher, Eric Huenger, and Scott Kisting. 2011. “Evaluation of Low Stress Photo-Sensitive Spin On Dielectric Layers for Through Silicon Via (TSV) Copper Redistribution Layers.” IMAPSource Proceedings 2011 (DPC): 666–98. https:/​/​doi.org/​10.4071/​2011DPC-ta32.
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