Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Advanced 3DIC Die Stacking for Memory and Mobile Applications
Advanced 3DIC Die Stacking for Memory and Mobile Applications
Dave Hiner,
Hiner, Dave. 2011. “Advanced 3DIC Die Stacking for Memory and Mobile Applications.” IMAPSource Proceedings 2011 (DPC): 766–80. https://doi.org/10.4071/2011DPC-tp12.