Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Processing and Reliability Assessment of Silicon Based, Integrated Ultra High Density Substrates
Processing and Reliability Assessment of Silicon Based, Integrated Ultra High Density Substrates
Brian J. Lewis, D. F. Baldwin, P. N. Houston, B. Smith, P. Kwok, J. Thompson. A. Mueller, L. Racz,
Lewis, Brian J., D. F. Baldwin, P. N. Houston, B. Smith, P. Kwok, J. Thompson. A. Mueller, and L. Racz. 2011. “Processing and Reliability Assessment of Silicon Based, Integrated Ultra High Density Substrates.” IMAPSource Proceedings 2011 (DPC): 2272–2313. https://doi.org/10.4071/2011DPC-tha23.