Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Cu-Cu Thermocompression Bonding using Ultra Precision Cutting of Cu Bumps for 3D-SIC
Cu-Cu Thermocompression Bonding using Ultra Precision Cutting of Cu Bumps for 3D-SIC
Taiji Sakai, Akamatsu Toshiya, Nobuhiro Imaizumi, Miyajima Toyoo, Masataka Mizukoshi,
Sakai, Taiji, Akamatsu Toshiya, Nobuhiro Imaizumi, Miyajima Toyoo, and Masataka Mizukoshi. 2011. “Cu-Cu Thermocompression Bonding Using Ultra Precision Cutting of Cu Bumps for 3D-SIC.” IMAPSource Proceedings 2011 (DPC): 1316–41. https://doi.org/10.4071/2011DPC-wa14.