Cu-Cu Thermocompression Bonding using Ultra Precision Cutting of Cu Bumps for 3D-SIC

Taiji Sakai; Akamatsu Toshiya; Nobuhiro Imaizumi; Miyajima Toyoo; Masataka Mizukoshi

doi:10.4071/2011DPC-wa14

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Sakai, Taiji, Akamatsu Toshiya, Nobuhiro Imaizumi, Miyajima Toyoo, and Masataka Mizukoshi. 2011. “Cu-Cu Thermocompression Bonding Using Ultra Precision Cutting of Cu Bumps for 3D-SIC.” IMAPSource Proceedings 2011 (DPC): 1316–41. https://doi.org/10.4071/2011DPC-wa14.

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