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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Cu-Cu Thermocompression Bonding using Ultra Precision Cutting of Cu Bumps for 3D-SIC
Taiji Sakai
,
Akamatsu Toshiya
,
Nobuhiro Imaizumi
,
Miyajima Toyoo
,
Masataka Mizukoshi
,
Cu-Cu bonding
ultra precision cutting
low temperature
•
https://doi.org/10.4071/2011DPC-wa14
IMAPSource Conference Papers
Sakai, Taiji, Akamatsu Toshiya, Nobuhiro Imaizumi, Miyajima Toyoo, and Masataka Mizukoshi. 2011. “Cu-Cu Thermocompression Bonding Using Ultra Precision Cutting of Cu Bumps for 3D-SIC.”
IMAPSource Proceedings
2011 (DPC): 1316–41.
https://doi.org/10.4071/2011DPC-wa14
.
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