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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Failure Analysis and Reliability of 3D Integrated Systems

Peter Ramm, Armin Klumpp, German Franz, Laurens Kwakman,
TSV technology 3D integrated systems Reliability
• https://doi.org/10.4071/2011DPC-tha11
IMAPSource Conference Papers
Ramm, Peter, Armin Klumpp, German Franz, and Laurens Kwakman. 2011. “Failure Analysis and Reliability of 3D Integrated Systems.” IMAPSource Proceedings 2011 (DPC): 2071–2111. https://doi.org/10.4071/2011DPC-tha11.
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