Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Formulation of Percolating Thermal Underfill by Sequential Convective Gap Filling
Formulation of Percolating Thermal Underfill by Sequential Convective Gap Filling
T. Brunschwiler, J. Goicochea, H. Wolf, C. Kuemin, B. Michel,
Brunschwiler, T., J. Goicochea, H. Wolf, C. Kuemin, and B. Michel. 2011. “Formulation of Percolating Thermal Underfill by Sequential Convective Gap Filling.” IMAPSource Proceedings 2011 (DPC): 1621–48. https://doi.org/10.4071/2011DPC-wp15.