Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Copper Migration in Flip-Chip Substrates Under Biased-HAST Conditions
Copper Migration in Flip-Chip Substrates Under Biased-HAST Conditions
Matthew E. Stahley, John W. Osenbach,
Stahley, Matthew E., and John W. Osenbach. 2011. “Copper Migration in Flip-Chip Substrates Under Biased-HAST Conditions.” IMAPSource Proceedings 2011 (DPC): 2465–80. https://doi.org/10.4071/2011DPC-tha35.