Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera’s MVP (TSV) Technology
300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera’s MVP (TSV) Technology
Dave Thomas, Matthew Muggeridge, Mike Steel, Dorleta Cortaberria Sanz, Hefin Griffiths, Oliver Ansell, Moshe Kriman, Andrey Grinman, Hagit Gershtenman-Avsian,
Thomas, Dave, Matthew Muggeridge, Mike Steel, Dorleta Cortaberria Sanz, Hefin Griffiths, Oliver Ansell, Moshe Kriman, Andrey Grinman, and Hagit Gershtenman-Avsian. 2011. “300mm Scaling of Critical Silicon Etches for Image Sensor Wafer-Level Packaging Based on Tessera’s MVP (TSV) Technology.” IMAPSource Proceedings 2011 (DPC): 2254–71. https://doi.org/10.4071/2011DPC-tha22.
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