Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball Geometry
Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball Geometry
Roelfs, Bernd, and Kai Matejat. 2011. “Electrolytic Solder Deposition for IC-Substrates: From Deposition Uniformity to Solder Ball Geometry.” IMAPSource Proceedings 2011 (DPC): 2424–64. https://doi.org/10.4071/2011DPC-tha34.
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