Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Novel Die-to-Wafer Interconnect Process for 3D-IC Utilizing a Thermo-Decomposable Adhesive and Cu-Cu Thermo-Compression Bonding
Novel Die-to-Wafer Interconnect Process for 3D-IC Utilizing a Thermo-Decomposable Adhesive and Cu-Cu Thermo-Compression Bonding
Pascual, Daniel N. 2011. “Novel Die-to-Wafer Interconnect Process for 3D-IC Utilizing a Thermo-Decomposable Adhesive and Cu-Cu Thermo-Compression Bonding.” IMAPSource Proceedings 2011 (DPC): 781–96. https://doi.org/10.4071/2011DPC-tp13.
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