Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Wafer Level Package for MEMS with TSVs and Hermetic Seal
Wafer Level Package for MEMS with TSVs and Hermetic Seal
Shiraishi, Akinori, Mitsutoshi Higashi, Kei Murayama, Yuichi Taguchi, and Kenichi Mori. 2011. “Wafer Level Package for MEMS with TSVs and Hermetic Seal.” IMAPSource Proceedings 2011 (DPC): 2314–35. https://doi.org/10.4071/2011DPC-tha24.
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