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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
3D TSV Products
Phil Marcoux
,
3D
TSV
Reliability
Design
•
https://doi.org/10.4071/2011DPC-ta11
IMAPSource Conference Papers
Marcoux, Phil. 2011. “3D TSV Products.”
IMAPSource Proceedings
2011 (DPC): 434–57.
https://doi.org/10.4071/2011DPC-ta11
.
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