Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Electromigration in Solder Joints for High Temperature Flip-Chip Application
Electromigration in Solder Joints for High Temperature Flip-Chip Application
Nowottnick, Mathias, and Andreas Fix. 2011. “Electromigration in Solder Joints for High Temperature Flip-Chip Application.” IMAPSource Proceedings 2011 (DPC): 2481–2506. https://doi.org/10.4071/2011DPC-tha36.
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