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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Impact of Process Improvements on Reliability of RCP Technology During Scale-up

George R. Leal, Scott Hayes, Dominic Koey, Tony Gong, Doug Mitchell, Gao Wei, Jason Wright, Tony Vessa,
RCPReliabilityEmbedded Die Packaging
https://doi.org/10.4071/2011DPC-tp35
IMAPSource Conference Papers
Leal, George R., Scott Hayes, Dominic Koey, Tony Gong, Doug Mitchell, Gao Wei, Jason Wright, and Tony Vessa. 2011. “Impact of Process Improvements on Reliability of RCP Technology During Scale-Up.” IMAPSource Proceedings 2011 (DPC): 1105–25. https:/​/​doi.org/​10.4071/​2011DPC-tp35.
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