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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Coaxial Through-Strata-Via (TSV) Analysis and Modeling

Zheng Xu, James Jian-Qiang Lu,
Coaxial TSV3D integrationWideband modeling
https://doi.org/10.4071/2011DPC-tha12
IMAPSource Conference Papers
Xu, Zheng, and James Jian-Qiang Lu. 2011. “Coaxial Through-Strata-Via (TSV) Analysis and Modeling.” IMAPSource Proceedings 2011 (DPC): 2112–34. https:/​/​doi.org/​10.4071/​2011DPC-tha12.

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