Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging

Brian Grummel; Habib A. Mustain; Z. John Shen; Allen R. Hefner

doi:10.4071/HITEN-Paper6-BGrummel

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Grummel, Brian, Habib A. Mustain, Z. John Shen, and Allen R. Hefner. 2011. “Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging.” IMAPSource Proceedings 2011 (HITEN): 77–83. https://doi.org/10.4071/HITEN-Paper6-BGrummel.

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