Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging
Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging
Brian Grummel, Habib A. Mustain, Z. John Shen, Allen R. Hefner,
Grummel, Brian, Habib A. Mustain, Z. John Shen, and Allen R. Hefner. 2011. “Comparison of Au-In Transient Liquid Phase Bonding Designs for SiC Power Semiconductor Device Packaging.” IMAPSource Proceedings 2011 (HITEN): 77–83. https://doi.org/10.4071/HITEN-Paper6-BGrummel.