Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications
High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications
Riches, S T, C Johnston, M Sousa, and P Grant. 2011. “High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications.” IMAPSource Proceedings 2011 (HITEN): 251–54. https://doi.org/10.4071/HITEN-Paper8-SRiches.
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