Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization
Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization
Cyril Buttay, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, Christophe Raynaud, Hervé Morel,
Buttay, Cyril, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, Christophe Raynaud, and Hervé Morel. 2011. “Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization.” IMAPSource Proceedings 2011 (HITEN): 84–90. https://doi.org/10.4071/HITEN-Paper7-CButtay.
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