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High Temperature Conference Papers
Vol. 2011, Issue HITEN, 2011
January 01, 2011 EDT
Package Reliability of the SiC Power Modules in Harsh Environments
Fengqun Lang
,
Hiroshi Yamaguchi
,
Hiroshi Sato
,
High-temperature electronics
SiC devices
Power modules
Thermo-mechanical reliability
Active Metalized Copper (AMC)
•
https://doi.org/10.4071/HITEN-Paper2-FLang
IMAPSource Conference Papers
Lang, Fengqun, Hiroshi Yamaguchi, and Hiroshi Sato. 2011. “Package Reliability of the SiC Power Modules in Harsh Environments.”
IMAPSource Proceedings
2011 (HITEN): 139–44.
https://doi.org/10.4071/HITEN-Paper2-FLang
.
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