ISSN 2380-4505
Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Package Reliability of the SiC Power Modules in Harsh Environments
Package Reliability of the SiC Power Modules in Harsh Environments
Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Sato,
Lang, Fengqun, Hiroshi Yamaguchi, and Hiroshi Sato. 2011. “Package Reliability of the SiC Power Modules in Harsh Environments.” IMAPSource Proceedings 2011 (HITEN): 139–44. https://doi.org/10.4071/HITEN-Paper2-FLang.