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High Temperature Conference Papers
Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT

Package Reliability of the SiC Power Modules in Harsh Environments

Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Sato,
High-temperature electronicsSiC devicesPower modulesThermo-mechanical reliabilityActive Metalized Copper (AMC)
https://doi.org/10.4071/HITEN-Paper2-FLang
IMAPSource Conference Papers
Lang, Fengqun, Hiroshi Yamaguchi, and Hiroshi Sato. 2011. “Package Reliability of the SiC Power Modules in Harsh Environments.” IMAPSource Proceedings 2011 (HITEN): 139–44. https:/​/​doi.org/​10.4071/​HITEN-Paper2-FLang.
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