Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Au-Sn SLID bonding for high temperature applications
Au-Sn SLID bonding for high temperature applications
Torleif André Tollefsen, Andreas Larsson, Knut Aasmundtveit,
Tollefsen, Torleif André, Andreas Larsson, and Knut Aasmundtveit. 2011. “Au-Sn SLID Bonding for High Temperature Applications.” IMAPSource Proceedings 2011 (HITEN): 58–67. https://doi.org/10.4071/HITEN-Paper4-TTollefsen.