Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Characterization of LTCC-Thick Film Technology for 300°C Packaging
Characterization of LTCC-Thick Film Technology for 300°C Packaging
Tan Zhang, David Shaddock, Alexey Vert, Rui Zhang, R. Wayne Johnson,
Zhang, Tan, David Shaddock, Alexey Vert, Rui Zhang, and R. Wayne Johnson. 2011. “Characterization of LTCC-Thick Film Technology for 300°C Packaging.” IMAPSource Proceedings 2011 (HITEN): 46–51. https://doi.org/10.4071/HITEN-Paper2-TZhang.