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High Temperature Conference Papers
Vol. 2011, Issue HITEN, 2011
January 01, 2011 EDT
Characterization of LTCC-Thick Film Technology for 300°C Packaging
Tan Zhang
,
David Shaddock
,
Alexey Vert
,
Rui Zhang
,
R. Wayne Johnson
,
High Temperature
Packaging
LTCC
•
https://doi.org/10.4071/HITEN-Paper2-TZhang
IMAPSource Conference Papers
Zhang, Tan, David Shaddock, Alexey Vert, Rui Zhang, and R. Wayne Johnson. 2011. “Characterization of LTCC-Thick Film Technology for 300°C Packaging.”
IMAPSource Proceedings
2011 (HITEN): 46–51.
https://doi.org/10.4071/HITEN-Paper2-TZhang
.
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