Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Thin Film Multichip Packaging for High Temperature Digital Electronics
Thin Film Multichip Packaging for High Temperature Digital Electronics
Kun Fang, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, Alexey Vert,
Fang, Kun, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, and Alexey Vert. 2011. “Thin Film Multichip Packaging for High Temperature Digital Electronics.” IMAPSource Proceedings 2011 (HITEN): 39–45. https://doi.org/10.4071/HITEN-Paper1-RWJohnson.