Thin Film Multichip Packaging for High Temperature Digital Electronics

Kun Fang; Rui Zhang; Tami Isaacs-Smith; R. Wayne Johnson; Emad Andarawis; Alexey Vert

doi:10.4071/HITEN-Paper1-RWJohnson

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Fang, Kun, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, and Alexey Vert. 2011. “Thin Film Multichip Packaging for High Temperature Digital Electronics.” IMAPSource Proceedings 2011 (HITEN): 39–45. https://doi.org/10.4071/HITEN-Paper1-RWJohnson.

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