ISSN 2380-4505
Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Thin Film Multichip Packaging for High Temperature Digital Electronics
Thin Film Multichip Packaging for High Temperature Digital Electronics
Kun Fang, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, Alexey Vert,
Fang, Kun, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, and Alexey Vert. 2011. “Thin Film Multichip Packaging for High Temperature Digital Electronics.” IMAPSource Proceedings 2011 (HITEN): 39–45. https://doi.org/10.4071/HITEN-Paper1-RWJohnson.