Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Curved CMOS Image Sensors: Packaging Issues, Applications and Roadmaps
Curved CMOS Image Sensors: Packaging Issues, Applications and Roadmaps
Bertrand Chambion, G. Moulin, S. Caplet, C. Gaschet, S. Getin, A. Vandeneynde, W. Jahn, D. Henry, E. Hugot,
Chambion, Bertrand, G. Moulin, S. Caplet, C. Gaschet, S. Getin, A. Vandeneynde, W. Jahn, D. Henry, and E. Hugot. 2017. “Curved CMOS Image Sensors: Packaging Issues, Applications and Roadmaps.” IMAPSource Proceedings 2017 (DPC): 1–33. https://doi.org/10.4071/2017DPC-TP3_Presentation1.