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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Curved CMOS Image Sensors: Packaging Issues, Applications and Roadmaps

Bertrand Chambion, G. Moulin, S. Caplet, C. Gaschet, S. Getin, A. Vandeneynde, W. Jahn, D. Henry, E. Hugot,
Curved packagingCmos image sensorTunable curvature
https://doi.org/10.4071/2017DPC-TP3_Presentation1
IMAPSource Conference Papers
Chambion, Bertrand, G. Moulin, S. Caplet, C. Gaschet, S. Getin, A. Vandeneynde, W. Jahn, D. Henry, and E. Hugot. 2017. “Curved CMOS Image Sensors: Packaging Issues, Applications and Roadmaps.” IMAPSource Proceedings 2017 (DPC): 1–33. https:/​/​doi.org/​10.4071/​2017DPC-TP3_Presentation1.
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