Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology Without Molding and De-bonding Processes
Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology Without Molding and De-bonding Processes
Hong Xie, Daquan Yu, Zhenrui Huang, Zhiyi Xiao, Li Yang, Min Xiang,
Xie, Hong, Daquan Yu, Zhenrui Huang, Zhiyi Xiao, Li Yang, and Min Xiang. 2017. “Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology Without Molding and De-Bonding Processes.” IMAPSource Proceedings 2017 (DPC): 1–15. https://doi.org/10.4071/2017DPC-TP2_Presentation2.