Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Low Temperature Curable PI/PBO for Advanced Packaging
Low Temperature Curable PI/PBO for Advanced Packaging
Daisaku Matsukawa, Tadamitsu Nakamura, Tetsuya Enomoto, Noriyuki Yamazaki, Masayuki Ohe, Takeharu Motobe, Masato Nishimura,
Matsukawa, Daisaku, Tadamitsu Nakamura, Tetsuya Enomoto, Noriyuki Yamazaki, Masayuki Ohe, Takeharu Motobe, and Masato Nishimura. 2017. “Low Temperature Curable PI/PBO for Advanced Packaging.” IMAPSource Proceedings 2017 (DPC): 1–15. https://doi.org/10.4071/2017DPC-Poster_Matsukawa.