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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Development of high-yield and high-reliability design for high-performance ultra large scale 3DLSI processor

Hideki Kitada,
TSVRedundancyReliability
https://doi.org/10.4071/2017DPC-TA1_Presentation2
IMAPSource Conference Papers
Kitada, Hideki. 2017. “Development of High-Yield and High-Reliability Design for High-Performance Ultra Large Scale 3DLSI Processor.” IMAPSource Proceedings 2017 (DPC): 1–31. https:/​/​doi.org/​10.4071/​2017DPC-TA1_Presentation2.
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