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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Thermomechanical Modeling of Sintered Silver – A Fracture Mechanics-Based Approach

Paul Paret, Douglas DeVoto, Sreekant Narumanchi,
Sintered silverFEM modelingJ-integral
https://doi.org/10.4071/2017DPC-WP3B_Presentation1
IMAPSource Conference Papers
Paret, Paul, Douglas DeVoto, and Sreekant Narumanchi. 2017. “Thermomechanical Modeling of Sintered Silver – A Fracture Mechanics-Based Approach.” IMAPSource Proceedings 2017 (DPC): 1–15. https:/​/​doi.org/​10.4071/​2017DPC-WP3B_Presentation1.
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