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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

The effect of underfill on thermal stresses on logic ASIC and its electrical performance

Babak Talebanpour, Doug Link,
DSP clock performanceunderfilling processthermomechanical stresses
https://doi.org/10.4071/2017DPC-THA2_Presentation4
IMAPSource Conference Papers
Talebanpour, Babak, and Doug Link. 2017. “The Effect of Underfill on Thermal Stresses on Logic ASIC and Its Electrical Performance.” IMAPSource Proceedings 2017 (DPC): 1–20. https:/​/​doi.org/​10.4071/​2017DPC-THA2_Presentation4.
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