Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
The effect of underfill on thermal stresses on logic ASIC and its electrical performance
The effect of underfill on thermal stresses on logic ASIC and its electrical performance
Talebanpour, Babak, and Doug Link. 2017. “The Effect of Underfill on Thermal Stresses on Logic ASIC and Its Electrical Performance.” IMAPSource Proceedings 2017 (DPC): 1–20. https://doi.org/10.4071/2017DPC-THA2_Presentation4.
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