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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
The effect of underfill on thermal stresses on logic ASIC and its electrical performance
Babak Talebanpour
,
Doug Link
,
DSP clock performance
underfilling process
thermomechanical stresses
•
https://doi.org/10.4071/2017DPC-THA2_Presentation4
IMAPSource Conference Papers
Talebanpour, Babak, and Doug Link. 2017. “The Effect of Underfill on Thermal Stresses on Logic ASIC and Its Electrical Performance.”
IMAPSource Proceedings
2017 (DPC): 1–20.
https://doi.org/10.4071/2017DPC-THA2_Presentation4
.
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