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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

What is driving the 3D TSV technologies business: Market update and technical trends

Santosh Kumar, Thibault Buisson,
3D/2.5D PackagingThrough Silicon Via (TSV)Interposers
https://doi.org/10.4071/2017DPC-TA1_Presentation1
IMAPSource Conference Papers
Kumar, Santosh, and Thibault Buisson. 2017. “What Is Driving the 3D TSV Technologies Business: Market Update and Technical Trends.” IMAPSource Proceedings 2017 (DPC): 1–34. https:/​/​doi.org/​10.4071/​2017DPC-TA1_Presentation1.
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