Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band
Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band
Robert M. Weikle, H. Li, A. Arsenovic, S. Nadri, L. Xie, M.F. Bauwens, N. Alijabbari, N. Scott Barker, A.W. Lichtenberger,
Weikle, Robert M., H. Li, A. Arsenovic, S. Nadri, L. Xie, M.F. Bauwens, N. Alijabbari, N. Scott Barker, and A.W. Lichtenberger. 2017. “Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band.” IMAPSource Proceedings 2017 (DPC): 1–36. https://doi.org/10.4071/2017DPC-THA3_Presentation2.