Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band

Robert M. Weikle; H. Li; A. Arsenovic; S. Nadri; L. Xie; M.F. Bauwens; N. Alijabbari; N. Scott Barker; A.W. Lichtenberger

doi:10.4071/2017DPC-THA3_Presentation2

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Weikle, Robert M., H. Li, A. Arsenovic, S. Nadri, L. Xie, M.F. Bauwens, N. Alijabbari, N. Scott Barker, and A.W. Lichtenberger. 2017. “Micromachined Interfaces for Metrology and Packaging Applications in the Submillimeter-Wave Band.” IMAPSource Proceedings 2017 (DPC): 1–36. https://doi.org/10.4071/2017DPC-THA3_Presentation2.

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