Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
New Wafer Level Packaging Concept for Power LEDS
New Wafer Level Packaging Concept for Power LEDS
Marion Volpert, B. Soulier, P. Peray, N. Ait-Mani, A. Gasse, D. Henry, C. Tallet, V. Beix, A. Aboulaich, C. Zheng-Sung, J. L. Diot,
Volpert, Marion, B. Soulier, P. Peray, N. Ait-Mani, A. Gasse, D. Henry, C. Tallet, et al. 2017. “New Wafer Level Packaging Concept for Power LEDS.” IMAPSource Proceedings 2017 (DPC): 1–27. https://doi.org/10.4071/2017DPC-TP3_Presentation2.