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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Application of 3D PLUS WDoD technology for the manufacturing of electronic modules in implantable medical products
Pascal Couderc
,
WDoD
3D
SiP
•
https://doi.org/10.4071/2017DPC-TA2_Presentation4
IMAPSource Conference Papers
Couderc, Pascal. 2017. “Application of 3D PLUS WDoD Technology for the Manufacturing of Electronic Modules in Implantable Medical Products.”
IMAPSource Proceedings
2017 (DPC): 1–30.
https://doi.org/10.4071/2017DPC-TA2_Presentation4
.
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