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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Application of 3D PLUS WDoD technology for the manufacturing of electronic modules in implantable medical products

Pascal Couderc,
WDoD 3D SiP
• https://doi.org/10.4071/2017DPC-TA2_Presentation4
IMAPSource Conference Papers
Couderc, Pascal. 2017. “Application of 3D PLUS WDoD Technology for the Manufacturing of Electronic Modules in Implantable Medical Products.” IMAPSource Proceedings 2017 (DPC): 1–30. https://doi.org/10.4071/2017DPC-TA2_Presentation4.
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