Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)
Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)
Steffen Kroehnert, André Cardoso, Steffen Kroehnert, Raquel Pinto, Elisabete Fernandes, Isabel Barros,
Kroehnert, Steffen, André Cardoso, Steffen Kroehnert, Raquel Pinto, Elisabete Fernandes, and Isabel Barros. 2017. “Integration of MEMS in Fan-Out Wafer-Level Packaging Technology Based System-in-Package (WLSiP).” IMAPSource Proceedings 2017 (DPC): 1–23. https://doi.org/10.4071/2017DPC-TP2_Presentation6.