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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

3D Modular Power Electronic Packages and Modules for different power classes - from 50W to 50kW

Lars Böttcher, S. Karaszkiewicz, D. Manessis, A. Ostmann,
Power semiconductor packaging embedded actives and passives System in Package
• https://doi.org/10.4071/2017DPC-TP1_Presentation4
IMAPSource Conference Papers
Böttcher, Lars, S. Karaszkiewicz, D. Manessis, and A. Ostmann. 2017. “3D Modular Power Electronic Packages and Modules for Different Power Classes - from 50W to 50kW.” IMAPSource Proceedings 2017 (DPC): 1–34. https://doi.org/10.4071/2017DPC-TP1_Presentation4.
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