ISSN 2380-4505
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Wafer Thinning for Advanced Packaging Applications
Wafer Thinning for Advanced Packaging Applications
Laura Mauer, John Taddei, Scott Kroeger,
Mauer, Laura, John Taddei, and Scott Kroeger. 2017. “Wafer Thinning for Advanced Packaging Applications.” IMAPSource Proceedings 2017 (DPC): 1–26. https://doi.org/10.4071/2017DPC-WP2_Presentation1.