Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Fan-Out Packaging: Technologies and market trends
Fan-Out Packaging: Technologies and market trends
Jerome Azemar,
Azemar, Jerome. 2017. “Fan-Out Packaging: Technologies and Market Trends.” IMAPSource Proceedings 2017 (DPC): 1–35. https://doi.org/10.4071/2017DPC-TA2_Presentation1.