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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Trends in MEMS & Sensor Integration
Sitaram Arkalgud
,
mems
sensors
bonding
•
https://doi.org/10.4071/2017DPC-Keynote3_Arkalgud
IMAPSource Conference Papers
Arkalgud, Sitaram. 2017. “Trends in MEMS & Sensor Integration.”
IMAPSource Proceedings
2017 (DPC): 1–39.
https://doi.org/10.4071/2017DPC-Keynote3_Arkalgud
.
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