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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers

Atul Gupta, Eric Snyder, Christiane Gottschalke, Kevin Wenzel, James Gunn, Hao Lu, Yuya Suzuki, Venky Sundaram, Rao Tummala,
2.5D InterposerHigh Density FanoutOzone treatment
https://doi.org/10.4071/2017DPC-TP1_Presentation2
IMAPSource Conference Papers
Gupta, Atul, Eric Snyder, Christiane Gottschalke, Kevin Wenzel, James Gunn, Hao Lu, Yuya Suzuki, Venky Sundaram, and Rao Tummala. 2017. “First Demonstration of Fine Line RDL Yield Enhancement Using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers.” IMAPSource Proceedings 2017 (DPC): 1–19. https:/​/​doi.org/​10.4071/​2017DPC-TP1_Presentation2.
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