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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Hygrothermal aging of flip-chip assembled MOEMS

Maaike M. Visser Taklo, Daniel Nilsen Wright, Sigbjørn Kolberg, Astrid-Sofie B. Vardøy, Faycal Hamou, Andreas Vogl, Helge Kristiansen, Erik Kalland, Thor Bakke,
MOEMSIsotropic conductive adhesiveHygrothermal aging
https://doi.org/10.4071/2017DPC-THA3_Presentation3
IMAPSource Conference Papers
Visser Taklo, Maaike M., Daniel Nilsen Wright, Sigbjørn Kolberg, Astrid-Sofie B. Vardøy, Faycal Hamou, Andreas Vogl, Helge Kristiansen, Erik Kalland, and Thor Bakke. 2017. “Hygrothermal Aging of Flip-Chip Assembled MOEMS.” IMAPSource Proceedings 2017 (DPC): 1–25. https:/​/​doi.org/​10.4071/​2017DPC-THA3_Presentation3.
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