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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Development of Fan Out Package Platform for High Performance and RF Applications

Gaurav Sharma, Gaurav Sharma, Adam Beece, Gao Shan, Marcel Wieland,
High density fan outWafer level packagingSystem in PackageRF and 5G packagingInductorFanOutWLP
https://doi.org/10.4071/2017DPC-TP2_Presentation1
IMAPSource Conference Papers
Sharma, Gaurav, Gaurav Sharma, Adam Beece, Gao Shan, and Marcel Wieland. 2017. “Development of Fan Out Package Platform for High Performance and RF Applications.” IMAPSource Proceedings 2017 (DPC): 1–29. https:/​/​doi.org/​10.4071/​2017DPC-TP2_Presentation1.
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