Development of Fan Out Package Platform for High Performance and RF Applications

Gaurav Sharma; Gaurav Sharma; Adam Beece; Gao Shan; Marcel Wieland

doi:10.4071/2017DPC-TP2_Presentation1

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Sharma, Gaurav, Gaurav Sharma, Adam Beece, Gao Shan, and Marcel Wieland. 2017. “Development of Fan Out Package Platform for High Performance and RF Applications.” IMAPSource Proceedings 2017 (DPC): 1–29. https://doi.org/10.4071/2017DPC-TP2_Presentation1.

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