Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Development of Fan Out Package Platform for High Performance and RF Applications
Development of Fan Out Package Platform for High Performance and RF Applications
Gaurav Sharma, Gaurav Sharma, Adam Beece, Gao Shan, Marcel Wieland,
Sharma, Gaurav, Gaurav Sharma, Adam Beece, Gao Shan, and Marcel Wieland. 2017. “Development of Fan Out Package Platform for High Performance and RF Applications.” IMAPSource Proceedings 2017 (DPC): 1–29. https://doi.org/10.4071/2017DPC-TP2_Presentation1.