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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Technology Review of System in Package
Yashashree S. Wase
,
Feng Li
,
System in package
3D IC
packaging
thermal management
stacked die
reliability
•
https://doi.org/10.4071/2017DPC-TP1_Presentation1
IMAPSource Conference Papers
Wase, Yashashree S., and Feng Li. 2017. “Technology Review of System in Package.”
IMAPSource Proceedings
2017 (DPC): 1–20.
https://doi.org/10.4071/2017DPC-TP1_Presentation1
.
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