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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate
Ankita Verma
,
Baqar Tabrez
,
Lam Duong
,
Martin Wuest
,
Bare-die packages
Thermal performance
Warpage and manufacturability
•
https://doi.org/10.4071/2017DPC-THA2_Presentation3
IMAPSource Conference Papers
Verma, Ankita, Baqar Tabrez, Lam Duong, and Martin Wuest. 2017. “Manufacturability Trade-Offs of Bare-Die FCBGA Package Using Thin or Core-Less Substrate.”
IMAPSource Proceedings
2017 (DPC): 1–26.
https://doi.org/10.4071/2017DPC-THA2_Presentation3
.
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