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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate

Ankita Verma, Baqar Tabrez, Lam Duong, Martin Wuest,
Bare-die packagesThermal performanceWarpage and manufacturability
https://doi.org/10.4071/2017DPC-THA2_Presentation3
IMAPSource Conference Papers
Verma, Ankita, Baqar Tabrez, Lam Duong, and Martin Wuest. 2017. “Manufacturability Trade-Offs of Bare-Die FCBGA Package Using Thin or Core-Less Substrate.” IMAPSource Proceedings 2017 (DPC): 1–26. https:/​/​doi.org/​10.4071/​2017DPC-THA2_Presentation3.
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