Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate

Ankita Verma; Baqar Tabrez; Lam Duong; Martin Wuest

doi:10.4071/2017DPC-THA2_Presentation3

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Verma, Ankita, Baqar Tabrez, Lam Duong, and Martin Wuest. 2017. “Manufacturability Trade-Offs of Bare-Die FCBGA Package Using Thin or Core-Less Substrate.” IMAPSource Proceedings 2017 (DPC): 1–26. https://doi.org/10.4071/2017DPC-THA2_Presentation3.

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