Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate
Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate
Ankita Verma, Baqar Tabrez, Lam Duong, Martin Wuest,
Verma, Ankita, Baqar Tabrez, Lam Duong, and Martin Wuest. 2017. “Manufacturability Trade-Offs of Bare-Die FCBGA Package Using Thin or Core-Less Substrate.” IMAPSource Proceedings 2017 (DPC): 1–26. https://doi.org/10.4071/2017DPC-THA2_Presentation3.