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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Laser Debonding for 2.5D, 3D and Emerging Advanced Packaging Solutions

T. Uhrmann, Elisabeth Brandl, Thomas Uhrmann, Martin Eibelhuber, Harald Wiesbauer, Julian Bravin, Markus Wimplinger, Paul Lindner,
laser debondingtemporary carrierAdvanced Packaging
https://doi.org/10.4071/2017DPC-THA1_Presentation2
IMAPSource Conference Papers
Uhrmann, T., Elisabeth Brandl, Thomas Uhrmann, Martin Eibelhuber, Harald Wiesbauer, Julian Bravin, Markus Wimplinger, and Paul Lindner. 2017. “Laser Debonding for 2.5D, 3D and Emerging Advanced Packaging Solutions.” IMAPSource Proceedings 2017 (DPC): 1–21. https:/​/​doi.org/​10.4071/​2017DPC-THA1_Presentation2.
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