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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
Cu Pillar, RDL and Via Fill Challenges facing FOWLP
Eric Gongora
,
Elie Najjar
,
Thomas Richardson
,
Leo Linehan
,
John Commander
,
Cu Pillar
RDL
FOWLP
•
https://doi.org/10.4071/2017DPC-WP2_Presentation5
IMAPSource Conference Papers
Gongora, Eric, Elie Najjar, Thomas Richardson, Leo Linehan, and John Commander. 2017. “Cu Pillar, RDL and Via Fill Challenges Facing FOWLP.”
IMAPSource Proceedings
2017 (DPC): 1–18.
https://doi.org/10.4071/2017DPC-WP2_Presentation5
.
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