Vol. 2017, Issue DPC, 2017January 01, 2017 EDT
Advanced Materials and Interconnect Technologies for Next Generation Smart Devices
Advanced Materials and Interconnect Technologies for Next Generation Smart Devices
Rozalia Beica, Eric Huenger,
Beica, Rozalia, and Eric Huenger. 2017. “Advanced Materials and Interconnect Technologies for Next Generation Smart Devices.” IMAPSource Proceedings 2017 (DPC): 1–26. https://doi.org/10.4071/2017DPC-GBC_Presentation3.