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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017
January 01, 2017 EDT
What’s Happening in China Advanced Semiconductor Packaging Landscape?
Santosh Kumar
,
advanced packaging
ic market
china
wafer bumping
•
https://doi.org/10.4071/2017DPC-GBC_Presentation2
IMAPSource Conference Papers
Kumar, Santosh. 2017. “What’s Happening in China Advanced Semiconductor Packaging Landscape?”
IMAPSource Proceedings
2017 (DPC): 1–28.
https://doi.org/10.4071/2017DPC-GBC_Presentation2
.
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