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Device Packaging Conference Presentations
Vol. 2017, Issue DPC, 2017January 01, 2017 EDT

Heterogeneous Integration “packaging the Future”

Ron Huemoeller,
Semiconductor outlookheterogeneous integrationmoore's lawadvanced sip
https://doi.org/10.4071/2017DPC-Keynote1_Huemoeller
IMAPSource Conference Papers
Huemoeller, Ron. 2017. “Heterogeneous Integration ‘Packaging the Future.’” IMAPSource Proceedings 2017 (DPC): 1–53. https:/​/​doi.org/​10.4071/​2017DPC-Keynote1_Huemoeller.
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