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High Temperature Conference Papers
Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT

Development of thermal conductive sheet with low interfacial heat resistance

Masao Tomikawa, Akira Shimada, Yoichi Shinba,
thermal conductive sheetinterfacialheat resistanceresinconductive filler
https://doi.org/10.4071/2380-4491.2017.HiTEN.83
IMAPSource Conference Papers
Tomikawa, Masao, Akira Shimada, and Yoichi Shinba. 2017. “Development of Thermal Conductive Sheet with Low Interfacial Heat Resistance.” IMAPSource Proceedings 2017 (HiTEN): 83–88. https:/​/​doi.org/​10.4071/​2380-4491.2017.HiTEN.83.
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