Vol. 2017, Issue HiTEN, 2017July 01, 2017 EDT
Evaluation of High Temperature Joining Technologies for Semiconductor Die Attach
Evaluation of High Temperature Joining Technologies for Semiconductor Die Attach
Siyuan Qi, Chris Powley, Maria Mirgkizoudi, Adele Pliscott, Peter Collier,
Qi, Siyuan, Chris Powley, Maria Mirgkizoudi, Adele Pliscott, and Peter Collier. 2017. “Evaluation of High Temperature Joining Technologies for Semiconductor Die Attach.” IMAPSource Proceedings 2017 (HiTEN): 177–92. https://doi.org/10.4071/2380-4491.2017.HiTEN.177.