Die-Attach Voiding Reduction in Gold Alloy Solder Preforms

Bernard Leavitt; Andy C. Mackie

doi:10.4071/2380-4491.2017.HiTEN.99

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Leavitt, Bernard, and Andy C. Mackie. 2017. “Die-Attach Voiding Reduction in Gold Alloy Solder Preforms.” IMAPSource Proceedings 2017 (HiTEN): 99–102. https://doi.org/10.4071/2380-4491.2017.HiTEN.99.

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